Preferred Language
Articles
/
ChfcbZIBVTCNdQwCG7Be
CFD Investigation of the Soldering Process for a Small Spherical PCM Made of Lead-tin Alloy
...Show More Authors

Unlike welding, soldering does not involve melting the work pieces. Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint. Failure in the solder joint may make the system components lose their functions. Electrical wiring and electronic components are joined to devices and printed circuit boards using soldering. Soldering and brazing are both used in the assembly of musical instruments. Lead-tin alloy solder employed in the current investigation which has a diameter of 4 mm and a density of 11.0103 kg/m3 with continuous heat flux heating from the domain's left side and complete insulation on the other side. The melting of PCM was simulated using the ANSYS (Fluent) melting model. Three procedures were followed during the heating stage of the reflow process to perform the melting heat-transfer analysis. The simulation's results were recorded at regular intervals of 15 seconds. The results show melting rate increases as time proceeds. It is almost the same at the initial stages and increases in the middle and the end of the melting process. Heat transfer happens mostly through conduction during the first 0–30 seconds of the melting process, changing to natural convection as the material continues to heat up.

Scopus Crossref
View Publication
Publication Date
Sat Oct 30 2021
Journal Name
Iraqi Journal Of Science
Small Binary Codebook Design for Image Compression Depending on Rotating Blocks
...Show More Authors

     The searching process using a binary codebook of combined Block Truncation Coding (BTC) method and Vector Quantization (VQ), i.e. a full codebook search for each input image vector to find the best matched code word in the codebook, requires a long time.   Therefore, in this paper, after designing a small binary codebook, we adopted a new method by rotating each binary code word in this codebook into 900 to 2700 step 900 directions. Then, we systematized each code word depending on its angle  to involve four types of binary code books (i.e. Pour when , Flat when  , Vertical when, or Zigzag). The proposed scheme was used for decreasing the time of the coding procedure, with very small distortion per block, by designing s

... Show More
Scopus (1)
Crossref (1)
Scopus Crossref
Publication Date
Sun Jun 30 2002
Journal Name
Iraqi Journal Of Chemical And Petroleum Engineering
Determination of Surface Diffusion Coefficient for Adsorption Process
...Show More Authors

View Publication Preview PDF
Publication Date
Tue Jun 03 2014
Journal Name
Heat Transfer - Asian Research
CFD Simulation of Heat Transfer Augmentation in a Circular Tube fitted with Alternative Axis Twisted Tape in Laminar Flow under the Constant Heat Flux
...Show More Authors

Publication Date
Wed Nov 01 2017
Journal Name
Journal Of Engineering
Development the Mechanical Properties of (AL-Li-Cu) Alloy
...Show More Authors

The aim of this research is to develop mechanical properties of a new aluminium-lithium-copper alloy. This alloy prepared under control atmosphere by casting in a permanent metal mould. The microstructure was examined and mechanical properties were tested before and after heat treatment to study the influence of heat treatment on its mechanical properties including; modulus of elasticity, tensile strength, impact, and fatigue. The results showed that the modulus of elasticity of the prepared alloy is higher than standard alloy about 2%. While the alloy that heat treated for 6 h and cooled in water, then showed a higher ultimate tensile stress comparing with as-cast alloy. The homogenous heat treatment gives best fatigue

... Show More
View Publication Preview PDF
Publication Date
Sun Dec 05 2010
Journal Name
Baghdad Science Journal
Study the structure of Hg1-x Cdx Te alloy
...Show More Authors

A study carried out to prepare Hg1-xCdxTe compound and to see the effect on increasing the percentage of x on the compound structure by using x-ray diffraction and atomic absorption for 0

View Publication Preview PDF
Crossref
Publication Date
Tue Mar 14 2017
Journal Name
Ibn Al-haitham Journal For Pure And Applied Sciences
On e-Small Submodules
...Show More Authors

Let M be an R-module, where R is a commutative ring with unity. A submodule N of M is called e-small (denoted by N e  M) if N + K = M, where K e  M implies K = M. We give many properties related with this type of submodules.

View Publication Preview PDF
Publication Date
Mon Mar 01 2021
Journal Name
Journal Of Physics: Conference Series
On Small Semiprime Submodules
...Show More Authors
Abstract<p>Let R be a commutative ring with identity, and M be unital (left) R-module. In this paper we introduce and study the concept of small semiprime submodules as a generalization of semiprime submodules. We investigate some basis properties of small semiprime submodules and give some characterizations of them, especially for (finitely generated faithful) multiplication modules.</p>
Scopus (4)
Crossref (2)
Scopus Crossref
Publication Date
Thu Jul 01 2021
Journal Name
Journal Of Physics: Conference Series
J-Small Semiprime Submodules
...Show More Authors
Abstract<p>Let <italic>R</italic> be a commutative ring with identity and <italic>Y</italic> be an unitary <italic>R</italic>-module. We say a non-zero submodule <italic>s</italic> of <italic>Y</italic> is a <italic>J –</italic> small semiprime if and only if for whenever <italic>i</italic> ∈ <italic>R, y ∈ Y,(Y)</italic> is small in <italic>Y</italic> and <italic>i<sup>2</sup>y</italic> ∈ <italic>S</italic> + <italic>Rad (Y)</italic> implies <italic>iy</italic> ∈ <italic>S.</italic> In this paper, we investigate some properties and chara</p> ... Show More
Scopus Crossref
Publication Date
Sat May 01 2021
Journal Name
Journal Of Physics: Conference Series
Weakly Small Smiprime Submodules
...Show More Authors
Abstract<p>Let <italic>R</italic> be a commutative ring with an identity, and <italic>G</italic> be a unitary left <italic>R</italic>-module. A proper submodule <italic>H</italic> of an <italic>R</italic>-module <italic>G</italic> is called semiprime if whenever <italic>a ∈ R, y ∈ G, n ∈ Z</italic> <sup>+</sup> and <italic>a<sup>n</sup>y ∈ H</italic>, then <italic>ay ∈ H</italic>. We say that a properi submodule <italic>H</italic> of an <italic>R</italic>-module <italic>G</italic> is a weakly small semiprime, if whenever <ita></ita></p> ... Show More
Scopus Crossref
Publication Date
Tue Jan 01 2019
Journal Name
Italian Journal Of Pure And Applied Mathematics
Co-small monoform modules
...Show More Authors

he concept of small monoform module was introduced by Hadi and Marhun, where a module U is called small monoform if for each non-zero submodule V of U and for every non-zero homomorphism f ∈ Hom R (V, U), implies that ker f is small submodule of V. In this paper the author dualizes this concept; she calls it co-small monoform module. Many fundamental properties of co-small monoform module are given. Partial characterization of co-small monoform module is established. Also, the author dualizes the concept of small quasi-Dedekind modules which given by Hadi and Ghawi. She show that co-small monoform is contained properly in the class of the dual of small quasi-Dedekind modules. Furthermore, some subclasses of co-small monoform are investiga

... Show More
View Publication Preview PDF
Scopus