Unlike welding, soldering does not involve melting the work pieces. Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint. Failure in the solder joint may make the system components lose their functions. Electrical wiring and electronic components are joined to devices and printed circuit boards using soldering. Soldering and brazing are both used in the assembly of musical instruments. Lead-tin alloy solder employed in the current investigation which has a diameter of 4 mm and a density of 11.0103 kg/m3 with continuous heat flux heating from the domain's left side and complete insulation on the other side. The melting of PCM was simulated using the ANSYS (Fluent) melting model. Three procedures were followed during the heating stage of the reflow process to perform the melting heat-transfer analysis. The simulation's results were recorded at regular intervals of 15 seconds. The results show melting rate increases as time proceeds. It is almost the same at the initial stages and increases in the middle and the end of the melting process. Heat transfer happens mostly through conduction during the first 0–30 seconds of the melting process, changing to natural convection as the material continues to heat up.
Let
Let R be a commutative ring with identity, and M be unital (left) R-module. In this paper we introduce and study the concept of small semiprime submodules as a generalization of semiprime submodules. We investigate some basis properties of small semiprime submodules and give some characterizations of them, especially for (finitely generated faithful) multiplication modules.
he concept of small monoform module was introduced by Hadi and Marhun, where a module U is called small monoform if for each non-zero submodule V of U and for every non-zero homomorphism f ∈ Hom R (V, U), implies that ker f is small submodule of V. In this paper the author dualizes this concept; she calls it co-small monoform module. Many fundamental properties of co-small monoform module are given. Partial characterization of co-small monoform module is established. Also, the author dualizes the concept of small quasi-Dedekind modules which given by Hadi and Ghawi. She show that co-small monoform is contained properly in the class of the dual of small quasi-Dedekind modules. Furthermore, some subclasses of co-small monoform are investiga
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Heat pipes and two‐phase thermosyphon systems are passive heat transfer systems that employ a two‐phase cycle of a working fluid within a completely sealed system. Consequently, heat exchangers based on heat pipes have low thermal resistance and high effective thermal conductivity, which can reach up to the order of (105 W/(m K)). In energy recovery systems where the two streams should be unmixed, such as airconditioning systems of biological laboratories and operating rooms in hospitals, heat pipe heat exchangers (HPHEs) are recommended. In this study, an experimental and theoretical study was carried out on the thermal performance of an air‐to‐air HPHE filled with two refrigerants as working fluids, R22 and R407c. The heat pipe he
... Show MoreThisstudy aims to determine the specifications of obese women accordingto the heightand type of obesity. It also aimstoidentify the significance of differences in choosing ready-made clothes for the research sample. Finally, the significance of differences in choosing ready-made clothes according to the variable of binaryclassification ofobesity is also identified.The study sample includes obese women: employees, non-employees and students with the age group (18-50) years.The weights and lengths of the sample have been taken to suit the group of obese women.Aquestionnaire in the form of an open question was distributed among (50) obese womenso as to extract the items of the questionnaire. After that, the questionnaire was distributed amo
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