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Highly adaptive and deadlock‐free routing for three‐dimensional networks‐on‐chip
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This study proposes a new method for designing adaptive routing algorithms for three‐dimensional (3D) networks‐on‐chip (NoCs). This method is based on extending the existing 2D turn model adaptive routing to a 3D scenario. A 3D plane‐balanced approach with maximal degree of adaptiveness is achieved by applying a well‐defined set of rules for different strata of the 3D NoC. The proposed method is applicable to any of the turn models. In this study, the authors employ odd–even turn model as a basis for introducing the proposed strategy. Experimental results show that the new 3D odd–even turn model can achieve up to 28.5% improvement in performance over conventional 3D odd–even approach. The improvement is consistent for different traffic types and selection strategies. The proposed method enables a new avenue to explore adaptive approaches for future large‐scale 3D integration.

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Publication Date
Thu May 18 2023
Journal Name
Journal Of Engineering
A Comparative Study of Single-Constraint Routing in Wireless Mesh Networks Using Different Dynamic Programming Algorithms
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Finding the shortest route in wireless mesh networks is an important aspect. Many techniques are used to solve this problem like dynamic programming, evolutionary algorithms, weighted-sum techniques, and others. In this paper, we use dynamic programming techniques to find the shortest path in wireless mesh networks due to their generality, reduction of complexity and facilitation of numerical computation, simplicity in incorporating constraints, and their onformity to the stochastic nature of some problems. The routing problem is a multi-objective optimization problem with some constraints such as path capacity and end-to-end delay. Single-constraint routing problems and solutions using Dijkstra, Bellman-Ford, and Floyd-Warshall algorith

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Publication Date
Sun May 01 2016
Journal Name
Journal Of Engineering
Three-Dimensional Finite Element Simulation of the Buried Pipe Problem in Geogrid Reinforced Soil
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Buried pipeline systems are commonly used to transport water, sewage, natural oil/gas and other materials. The beneficial of using geogrid reinforcement is to increase the bearing capacity of the soil and decrease the load transfer to the underground structures.

This paper deals with simulation of the buried pipe problem numerically by finite elements method using the newest version of PLAXIS-3D software. Rajkumar and Ilamaruthi's study, 2008 has been selected to be reanalyzed as 3D problem because it is containing all the properties needed by the program such as the modulus of elasticity, Poisson's ratio, angle of internal friction. It was found that the results

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Publication Date
Thu Jan 01 2026
Journal Name
Ieee Transactions On Cognitive And Developmental Systems
M2RU: Memristive Minion Recurrent Unit for On-Chip Continual Learning at the Edge
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Continual learning on edge platforms remains challenging because recurrent networks depend on energy-intensive training procedures and frequent data movement that are impractical for embedded deployments. This work introduces M2RU, a mixed-signal architecture that implements the minion recurrent unit for efficient temporal processing with on-chip continual learning. The architecture integrates weighted-bit streaming, which enables multi-bit digital inputs to be processed in crossbars without high-resolution conversion, and an experience replay mechanism that stabilizes learning under domain shifts. M2RU achieves ∼13 GOPS at 16.76 mW, corresponding to 776 GOPS per watt, and maintains accuracy within 5 percent of software baselines on seque

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Publication Date
Tue Jun 01 2021
Journal Name
Iop Conference Series: Earth And Environmental Science
Evaluating the effects of reservoir level and foundation depth on the dynamic behaviour of a rockfill dam using three-dimensional finite elements modelling
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Abstract<p>This paper presents a three-dimensional Dynamic analysis of a rockfill dam with different foundation depths by considering the dam connection with both the reservoir bed and water. ANSYS was used to develop the three-dimensional Finite Element (FE) model of the rockfill dam. The essential objective of this study is the discussion of the effects of different foundation depths on the Dynamic behaviour of an embanked dam. Four foundation depths were investigated. They are the dam without foundation (fixed base), and three different depths of the foundation. Taking into consideration the changing of upstream water level, the empty, minimum, and maximum water levels, the results of the three-dimensional F</p> ... Show More
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Publication Date
Sun Jun 30 2019
Journal Name
Journal Of The College Of Education For Women
Use The Wallpaper Three-Dimensional in Living Room in the House of Iraq (Future spaces)
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يرغب المرء أن يعيش في منزل يعبر عن اصالة تصميمه ذا اهداف جمالية كحاجته الى تحقيق الأهداف العملية. وعليه فمن الأهمية بمكان ان يشارك أصحابه مع المعنيين[1] بشؤون التصميم... وهنا ارتأت الباحثة ان تقوم بدراسة علمية حديثة حول ورق الجدران ثلاثي الابعاد وتوظيفة في غرفة المعيشة, وباسلوب عصري حديث يجمع بين جمالية التصميم والحداثة , إضافة الى تناول الإضاءة لما لها من دور في ابراز معالم وتفاصيل الأثاث

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Publication Date
Fri Feb 13 2026
Journal Name
Proceedings Of The Institution Of Mechanical Engineers, Part L: Journal Of Materials: Design And Applications
Analysis of radio-opacity, surface roughness, and wettability of calcium carbonate nanoparticle-reinforced three-dimensional printed acrylic resin
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Background

Additive manufacturing (3D-printed) technology is a major advancement in prosthodontics, offering efficiency, cost-effectiveness, and the production of high-quality prostheses. Nanoparticles have been included in three-dimensional (3D) printed denture bases to enhance their physico-mechanical and biological characteristics. This work aims to examine the influences of adding calcium carbonate nanoparticles to 3D-printed denture base resins on their radio-opacity, wettability, and surface roughness.

Material and method
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Publication Date
Mon Jun 01 2020
Journal Name
Journal Of Engineering
Reliability Analysis of Multibit Error Correcting Coding and Comparison to Hamming Product Code for On-Chip Interconnect
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Error control schemes became a necessity in network-on-chip (NoC) to improve reliability as the on-chip interconnect errors increase with the continuous shrinking of geometry. Accordingly, many researchers are trying to present multi-bit error correction coding schemes that perform a high error correction capability with the simplest design possible to minimize area and power consumption. A recent work, Multi-bit Error Correcting Coding with Reduced Link Bandwidth (MECCRLB), showed a huge reduction in area and power consumption compared to a well-known scheme, namely, Hamming product code (HPC) with Type-II HARQ. Moreover, the authors showed that the proposed scheme can correct 11 random errors which is considered a high

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Publication Date
Fri Dec 20 2019
Journal Name
Iet Circuits, Devices &amp; Systems
Multi‐bit error control coding with limited correction for high‐performance and energy‐efficient network on chip
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In the presence of deep submicron noise, providing reliable and energy‐efficient network on‐chip operation is becoming a challenging objective. In this study, the authors propose a hybrid automatic repeat request (HARQ)‐based coding scheme that simultaneously reduces the crosstalk induced bus delay and provides multi‐bit error protection while achieving high‐energy savings. This is achieved by calculating two‐dimensional parities and duplicating all the bits, which provide single error correction and six errors detection. The error correction reduces the performance degradation caused by retransmissions, which when combined with voltage swing reduction, due to its high error detection, high‐energy savings are achieved. The res

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Publication Date
Tue Mar 22 2022
Journal Name
Acm Journal On Emerging Technologies In Computing Systems
Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era
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Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created wh

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Publication Date
Tue Jan 01 2019
Journal Name
Aip Conference Proceedings
Highly selective CdS:Ag heterojunction for photodetector applications
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