Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created wh

This study proposes a new method for designing adaptive routing algorithms for three‐dimensional (3D) networks‐on‐chip (NoCs). This method is based on extending the existing 2D turn model adaptive routing to a 3D scenario. A 3D plane‐balanced approach with maximal degree of adaptiveness is achieved by applying a well‐defined set of rules for different strata of the 3D NoC. The proposed method is applicable to any of the turn models. In this study, the authors employ odd–even turn model as a basis for introducing the proposed strategy. Experimental results show that the new 3D odd–even turn model can achieve up to 28.5% improvement in performance over conventional 3D odd–even approach. The improvement is consistent fo