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This paper presents calculat,ion of thermal conductivity (K) of palm
leaf experimentally using Lee s disc method to be used as thermal
insulator. The therma l conducti vity is found to be equal to (k=0.03W/mK)
indicating that palm l eaf is a good thermal insulator com pared to the other insulators. The effect of the thermal insulator thickness on temperature di lTt::rence, heat transfer coefficient, thermal conductance, thermal resistance, thermal insulation are in vestigated in this paper. It was found that
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