ABSTRACT Background: One of the challenges to use chlorhexidine is its effect on the amount of microleakage after restoration; however, use of the materials with antibacterial properties after tooth preparation and before restoration has been widespread. The objective of this, in-vitro, study was to evaluate the influence of consepsis (chlorhexidine gloconate disinfectant) application on microleakage in class II cavities restored with light cured composite using universal adhesive system; etch and rinse technique –self etch technique. Materials and Methods: Forty class II cavities were prepared on mesial and distal surfaces of 20 non-carious mandibular third molars. The cavities were divided into four groups; (n =10 for each group). G1: cavities were bonded with (single bond universal adhesive, 3MESPE) after etching with 35% phosphoric acid - etch and rinse technique, without chlorhexidine , G2: chlorhexidine was used after etching with 35% phosphoric acid, then cavities were bonded with (single bond universal adhesive, 3MESPE) - etch and rinse technique . G3: cavities were bonded with (single bond universal adhesive, 3MESPE) - self etch technique, without chlorhexidine, G4: The chlorhexidine was used before bonding. All groups were restored with non – hybrid composite resin (Z 350, 3MESPE). Micrlerackage was evaluated at gingival margin using methylene blue dye penetration method. In each cavity the dye penetration in millimeters was measured by strereomicroscope. Statistical analysis for the data was carried out using one-way ANOVA and LSD test. Results: Group G2 produced the least microleakage which is statistically highly significantly different than the remaining groups. Group G3 produced the highest microleakage which is statistically high significant difference than G1 and G2, but the difference is not significant with group G4. Conclusions: Consepsis can be used as cavity disinfectants when restoring the cavities with single bond universal adhesive as etch and rinse technique. However, its effect seems to be lower when using the single bond universal adhesive as self-etch technique.