Background: tooth debonding was one of the major reasons for denture repair. With the use of recently introduced thermoplastic denture base materials the problem of tooth debonding increased due to the nature of the bond between these materials and the acrylic teeth. This study was aimed to assess the bond of the acrylic teeth to conventional heat cure acrylic resin and to thermoplastic resin denture base material and methods to enhance it. Materials and methods: acrylic resin teeth were bonded to heat cure acrylic resin with and without wetting the ridge laps of the teeth with monomer and acrylic teeth with prefabricated retentive holes, unmodified and modified, in their ridge laps were processed with Valplast thermoplastic resin denture base material. The samples were subjected to tensile forces till failure. Results: In general the chemical bond strength of acrylic teeth and heat cure acrylic resin was greater than the mechanical bond strength of the teeth with the Valplast thermoplastic denture base material. Wetting the acrylic resin teeth with monomer enhanced the bond strength with heat cure acrylic resin by 88%. Modifying the prefabricated retentive means of the acrylic resin teeth enhanced the bond strength with the Valplast thermoplastic resin denture base material by 58% Conclusion: wetting the ridge laps of the teeth can increase the bond strength of acrylic teeth and the conventional heat cure resin. A partial solution for the debonding of teeth from Valplast thermoplastic resin dentures is by modifying the prefabricated retentive means for the acrylic teeth to increase the bond strength.
In the present work, the thermo-fluid characteristics of a heat exchanger formed of helical coiled tubes immersed in cold water are investigated experimentally. Two types of helical coiled tube are tested, a conventional vertical single helical coiled tube and a new triple vertical helical coiled tube in parallel connection called as meshed coils. The effect of hot water flow rates inside the tubes (ranges from 2.67 to 7.08 l/min), and its inlet temperatures (namely 50, 60, 70 and 80 °C) are investigated. The experimental results show that increasing the flow rate inside the meshed coils leads to decrease the temperature difference between inlet and outlet. An enhancement of heat transfer for meshed coils compared to single coil has been n
... Show MoreIn this paper, an experimental analysis of conventional air-cooled and microchannel condensers in automotive vapor compression refrigeration cycle concerning heat transfer coefficient and energy using R134a as a refrigerant was presented. The performance of two condensers and cycles tested regarding ambient temperature which it was varied from 40oC to 65oC, while the indoor temperature and load have been set to be 23oC and 2200 W respectively. Results showed that the microchannel condenser has 224 % and 77 % higher refrigerant side and air side heat transfer coefficient respectively than the coefficients of the conventional condenser. Thus, the COP, in case of using the microchannel
... Show MoreA new metal complexes are made from the ligands derived from amoxicillin based Schiff's base coordinated with Pd(II) and Co(II) have been synthesized and characterized via different spectroscopic methods. FT-IR spectroscopy have shown a formation of tetrahedral and square planar geometry for Co(II) and Pd(II) complexes, respectively. Surface morphology was inspected via field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The Brunauer–Emmett–Teller surface area of the metal complexes samples is about 6.63 to 8.71 m2/g, with pore diameters and volume of 0.030–0.0501 cm3/g and 18.39–22.98 nm, respectively. The quadrupo
The choice of gate dielectric materials is fundamental for organic field effect transistors (OFET), integrated circuits, and several electronic applications. The operation of the OFET depends on two essential parameters: the insulation between the semiconductor layer and the gate electrode and the capacitance of the insulator. In this work, the electrical behavior of a pentacene-based OFET with a top contact / bottom gate was studied. Organic polyvinyl alcohol (PVA) and inorganic hafnium oxide (HfO2) were chosen as gate dielectric materials to lower the operation voltage to achieve the next generation of electronic applications. In this study, the performance of the OFET was studied using monolayer and bilayer gate insulators. To mo
... Show MoreThe choice of gate dielectric materials is fundamental for organic field effect transistors (OFET), integrated circuits, and several electronic applications. The operation of the OFET depends on two essential parameters: the insulation between the semiconductor layer and the gate electrode and the capacitance of the insulator. In this work, the electrical behavior of a pentacene-based OFET with a top contact / bottom gate was studied. Organic polyvinyl alcohol (PVA) and inorganic hafnium oxide (HfO2) were chosen as gate dielectric materials to lower the operation voltage to achieve the next generation of electronic applications. In this study, the performance of the OFET was studied using monolayer and bilayer gate insulators.
... Show MoreThermal management has grown more and more problematic as electronic components continue to get faster and smaller. One of the passive two-phase cooling systems are Oscillating heat pipe (OHP) that have the capacity to transmit a significant quantity of thermal energy across long distances. Oscillating heat pipe is a device that has the potential to satisfy this developing requirement. An investigation into the effects of orientation, filling ratio, and heat load on the initiation and characteristics of oscillatory motion, combining numerical simulations with experimental validation. A copper tube with a 2 mm inner diameter and a 2 mm wall thickness is used to fabricate the OHP. The condenser, evaporator, and adiabatic sections are
... Show More