Copper oxide (CuO) nanoparticles were synthesized through the thermal decomposition of a copper(II) Schiff-base complex. The complex was formed by reacting cupric acetate with a Schiff base in a 2:1 metal-to-ligand ratio. The Schiff base itself was synthesized via the condensation of benzidine and 2-hydroxybenzaldehyde in the presence of glacial acetic acid. This newly synthesized symmetric Schiff base served as the ligand for the Cu(II) metal ion complex. The ligand and its complex were characterized using several spectroscopic methods, including FTIR, UV-vis, 1H-NMR, 13C-NMR, CHNS, and AAS, along with TGA, molar conductivity and magnetic susceptibility measurements. The CuO nanoparticles were produced by thermally decomposing the complex at 800 °C. These nanoparticles and other metal oxides are highly valued in various industries for their optical, magnetic, and electrical properties. The experiment highlighted the synthesis of CuO nanoparticles through the thermal breakdown of copper(II) ions, starting with copper acetate, which reacted with the ligand to form the complex. The characterization results of CuO nanoparticles reveal a highly pure crystalline structure with an average size of 70–90 nm.
:Electron transfer (El) through molecular frameworks is. ce.ntral
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... Show MoreUniversities are among spaces where it's important to ensure thermal comfort in indoor spaces, improving the occupants' well-being and productivity. The problem of the research was to study appropriate glazing systems for the spaces of the University of Baghdad because glazing systems are one of the most important elements of the indoor environments, and it has a major impact on the thermal performance of buildings. Glass is one of the most seasoned materials that are most utilized in the design. Since it is a diaphanous material, it allows sunlight to enter the building, increasing the space's temperature, cooling loads, and energy consumption in summer. The research followed the experimental method by studying and
... Show MoreThis paper presents calculat,ion of thermal conductivity (K) of palm
leaf experimentally using Lee s disc method to be used as thermal
insulator. The therma l conducti vity is found to be equal to (k=0.03W/mK)
indicating that palm l eaf is a good thermal insulator com pared to the other insulators. The effect of the thermal insulator thickness on temperature di lTt::rence, heat transfer coefficient, thermal conductance, thermal resistance, thermal insulation are in vestigated in this paper. It was found that
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