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Thermal Enhancement from Pin Fins by Using Elliptical Perforations with Different Inclination Angles
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Abstract<p>Many of the proposed methods introduce the perforated fin with the straight direction to improve the thermal performance of the heat sink. The innovative form of the perforated fin (with inclination angles) was considered. Present rectangular pin fins consist of elliptical perforations with two models and two cases. The signum function is used for modeling the opposite and the mutable approach of the heat transfer area. To find the general solution, the degenerate hypergeometric equation was used as a new derivative method and then solved by Kummer's series. Two validation methods (previous work and Ansys 16.0‐Steady State Thermal) are considered. The strong agreement of the validation results (0.31% to 0.52%) lends to the reliability of the presented model. It was found that use of the perforated fin leads to decreased thermal resistance and improvement in the thermal performance of the pin fin by enhancing the heat transfer and increasing Nusselt number. Also, the increase of the inclination angle, size, and number of perforations can be used to optimize the present model by maximizing the heat transfer area and minimizing both the weight and length of the pin fins.</p>
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Publication Date
Wed May 29 2019
Journal Name
Iraqi Journal Of Physics
Weathering effects on the thermal conductivity of PS/PMMA blends for packaging application
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This work describes the weathering effects (UV-Irradiation, and Rain) on the thermal conductivity of PS, PMMA, PS/PMMA blend for packaging application. The samples were prepared by cast method at different ratios (10, 30, 50, 70, and 90 %wt). It was seen that the thermal conductivity of PMMA (0.145 W/m.K), and for PS(0.095 W/m.K), which increases by PS ratio increase up to 50% PS/PMMA blend then decreased that was attributed to increase in miscibility of the blend involved. By UV-weathering, it was seen that thermal conductivity for PMMA increased with UV-weathering up to (30hr) then decreased, that was attributed to rigidity and defect formation, respectively. For 30%PS/PMMA, there results showed unsystematic decrease in thermal conduct

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Publication Date
Mon Jan 01 2024
Journal Name
Aip Conference Proceedings
Modeling and analysis of thermal contrast based on LST algorithm for Baghdad city
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Publication Date
Sun Jul 09 2023
Journal Name
Journal Of Engineering
Performance Analysis of Four Conceptual Designs for the Air Based Photovoltaic / Thermal Collectors
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The  thermal  and  electrical  performance  of  different  designs  of  air  based  hybrid photovoltaic/thermal collectors is investigated experimentally and theoretically. The circulating air is used to cool PV panels and to collect the absorbed energy to improve their performance. Four different collectors have been designed, manufactured and instrumented namely; double PV panels without cooling (model I), single duct double pass collector (model II), double duct single pass (model III), and single duct single pass (model IV) . Each collector consists of: channel duct, glass cover, axial fan to circulate air and two PV panel in parallel connection. The temperature of the upper and

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Publication Date
Wed Jan 01 2020
Journal Name
Materials Research Express
Heavy metal free thermal stabilizing-flame retarding modifier for plasticized poly(vinyl chloride)
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Abstract<p>Our research aimed to find a new material that can be an efficient heavy metal free flame retardant for plasticized poly(vinyl chloride) comparable to the conventional flame retardants. One of these extraordinary materials is Oxydtron using as an admixture for concrete. Oxydtron showed unexpected efficiency as a flame retardant agent and an excellent heat stabilizer as well. Limiting oxygen index (LOI), static heat stability, Congo-red, and differential scanning calorimetry (DSC) were carried out. The thermal tests proved that Oxydtron is suitable to improve plasticized poly(vinyl chloride) performance at high temperatures applications in terms of flame retarding and thermal stability</p> ... Show More
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Publication Date
Tue Sep 01 2015
Journal Name
2015 Ieee International Circuits And Systems Symposium (icsys)
Investigating the impact of on-chip interconnection noise on Dynamic Thermal Management efficiency
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Dynamic Thermal Management (DTM) emerged as a solution to address the reliability challenges with thermal hotspots and unbalanced temperatures. DTM efficiency is highly affected by the accuracy of the temperature information presented to the DTM manager. This work aims to investigate the effect of inaccuracy caused by the deep sub-micron (DSM) noise during the transmission of temperature information to the manager on DTM efficiency. A simulation framework has been developed and results show up to 38% DTM performance degradation and 18% unattended cycles in emergency temperature under DSM noise. The finding highlights the importance of further research in providing reliable on-chip data transmission in DTM application.

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Publication Date
Fri Sep 30 2016
Journal Name
Iraqi Journal Of Chemical And Petroleum Engineering
Thermal and Catalytic Degradation Kinetics of High-Density Polyethylene Over NaX Nano-Zeolite
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Thermal and catalytic pyrolysis of waste plastics in an inert atmosphere has been regarded as a creative method, since pyrolysis can convert plastics waste into hydrocarbons that can be used either as fuels or as a source of chemicals.

Natural Iraqi kaolin clay was used to synthesis the NaX nano- zeolite by hydrothermal conditions with average particle size equal to 77.63nm.Thermal decomposition kinetics of high-density polyethylene (HDPE) in the absence and presence of catalysts nano NaX Zeolite was investigated. Thermal and catalytic degradation of HDPE was performed using a thermogravimetric analyzer in nitrogen atmosphere under non-isothermal conditions 4, 7 and 10 °C/min heating rates were employed in thermogravimetric anal

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Publication Date
Tue Apr 01 2014
Journal Name
International Communications In Heat And Mass Transfer
Determination of a time-dependent thermal diffusivity and free boundary in heat conduction
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Publication Date
Tue May 01 2018
Journal Name
Journal Of Physics: Conference Series
The Effects of micro Aluminum fillers In Epoxy resin on the thermal conductivity
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Publication Date
Mon May 22 2017
Journal Name
Ibn Al-haitham Journal For Pure And Applied Sciences
A Studied Some of the Thermal and Electrical Properties for Particulat Polymer Composites
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  This researchs the preparation of particulate polymer composites from Alkyd resin and Iraqi Burn Kaolin which were added as (20%,30%,40%,50%)and comparing  with the  polymer.  It studied Thermal conductivity and Dielectric strength for both of  the Alkyd resin and  the Composite Material.        The result showed an  increase in Dielectric strength after adding the Iraqi Burn Kaolin , also the Thermal conductivity was  increased by adding the Iraqi Burn Kaolin .

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Publication Date
Fri Mar 01 2024
Journal Name
Baghdad Science Journal
Study the Structural Properties of Porous Silicon and their Applications as Thermal Sensors
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The photo-electrochemical etching (PECE) method has been utilized to create pSi samples on n-type silicon wafers (Si). Using the etching time 12 and 22 min while maintaining the other parameters 10 mA/cm2 current density and HF acid at 75% concentration.. The capacitance and resistance variation were studied as the temperature increased and decreased for prepared samples at frequencies 10 and 20 kHz. Using scanning electron microscopy (SEM), the bore width, depth, and porosity % were validated. The formation of porous silicon was confirmed by x-ray diffraction (XRD) patterns, the crystal size was decreased, and photoluminescence (PL) spectra revealed that the emission peaks were centered at 2q of 28.5619° and 28.7644° for et

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