In this paper the effect of mixing TiO2 nanoparticles with epoxy resin is studied. The TiO2 nanoparticles would be synthesis and characterized by scanning electron microscopy (SEM), XRD FTIR, for two particle sizes of 50 and 25 nm. The thermal conductivity is measured with and without composite epoxy resin; the results showed that the thermal conductivity was increased as nanoparticle concentration increased too. The thermal conductivity was increased as particle size decreased.
A hand lay-up method was used to prepare Epoxy/ metal composites. Epoxy resin (EP) was used as a matrix with metal particles (Al, Cu, and Fe) as fillers.
The preparation method includes preparing square panels of composites with different weight percentage of fillers (10, 20, 30, 40, and 50%). Standard specimens (88mm in diameter) for thermal conductivity tests were prepared to measure thermal conductivity kexp.The result of experimental thermal conductivity kexp, for EP/metal composites show that, kexp increase with increasing weight percentage, For EP/ Al and EP/Cu composites, and it have have maximum values of 0.33 and 0.35 W/m.K, respectively. While kexp for EP/ Fe composite show slight increase with maximum value of 0.186 W/m.K.
This research studies the effect of adding micro, nano and hybrid by ratio (1:1) of (Al2O3,TiO2) to epoxy resin on thermal conductivity before and after immersion in HCl acid for (14 day) with normality (0.3 N) at weight fraction (0.02, 0.04, 0.06, 0.08) and thickness (6mm). The results of thermal conductivity reveled that epoxy reinforced by (Al2O3) and mixture (TiO2+Al2O3) increases with increasing the weight fraction, but the thermal conductivity (k) a values for micro and Nano (TiO2) decrease with increasing the weight fraction of reinforced, while the immersion in acidic solution (HCl) that the (k) values after immersion more than the value in before immersion.
The present studies are focused on the modification of the properties of epoxy resin with different additives namely aluminum, copper by preparing of composites systems with percentage (20%, 40% and 50%) of the above additives. The experimental results show that the D.C of conductivity on wt% filler content at ( 293-413 ) K electrical conductivity of all above composites increased with temperature for composites with filler contact and find the excellent electrical conductivity of copper and lie between (2.6*10-10 - 2.1*10-10)?.cm . The activation energy of the electrical conductivity is determined and found to decrease with increasing the filler concentration.
In this search, Ep/SiO2 at (3, 6, 9, 12 %) composites is prepared by hand Lay-up method, to measure the change in the thermal conductivity and Impact Strength of epoxy resin before and after immersion in H2SO4 Solution with a 0.3N for 10 days. The results before immersion decreases with the increase of the weight ratios of the reinforcement material (SiO2), It changed from (82.6×10-2 to 38.7×10-2 W/m.°C) with change weight ratios from (3 to 12) % respectively, but after immersion time in the chemical solution where it was (65.6×10-2 W/m.°C) at the weight ratios (6 %) and became (46.6 × 10-2 W/m.°C) after immersion in sulfuric acid. The results of the Impact strength decreased by increasing the percentage weight ratio, it changed f
... Show MoreThermal conductivity for epoxy composites filled with Al2O3 and Fe2O3 are
calculated, it found that increasing the weight ratio of Al2O3 and Fe2O3 lead to
increase in the values of thermal conductivity, but the epoxy composite filled with
Fe2O3, have values of thermal conductivity less than for epoxy composite filled with
Al2O3, for the same weight ratio. Also thermal conductivity calculated for epoxy
composites by contact to every two specimens (like sandwich) content same weight
ratio of alumina-oxide and ferrite-oxide, its found that the value of thermal
conductivity lays between the values of epoxy filled Al2O3 and of epoxy filled Fe2O3
In this study the thermal conductivity of the epoxy composites were characterized as function of volume fraction, particle size of fillers and the time of immersion(30,60,90)days in water .Composites plates were prepared by incorporating (bi-directional) (0º-90º) glass fiber and silicon carbide (SiC) particles of (0.1,0.5,1)mm as particle size at (10%,20%,30%,40%) percent volume in epoxy matrix.
The composites shows slightly increase of the thermal conductivity with increasing volume fraction, particle size and increase with increasing the days of immersion in water. The maximum thermal conductivity (0.51W/m.K) was obtained before the immersion in water at 90 days for epoxy reinforcement by bi-directional glass fiber and SiC particl
The dielectric properties of epoxy/palm oil fiber composites at different concentrations 1,3,5, and 10% by weight, and frequency ranging from 100 Hz to 1000kHz.Epoxy, zinc oxide and oil palm empty fruit bunch (OPEFB)fiber composites were prepared by hand –lay up into sheets. The effects of incorporated fibers on the electrical conductivity and thermal conductivity of the composites were investigated. The electrical conductivity of the composites decreased with increasing OPEFB fiber content. Despite the slight decrease in conductivity, the composites still sufficiently conductive relatively to applications such as sensors after the fiber addition, the thermal conductivity increased to 0.41
This work analyzes the impact of MgO nanoparticles on the properties of an epoxy resin solution with uniform structure and particular degree of cure synthesized by the reaction of epoxy resin and pyromellitic dianhydride. Various concentrations of epoxy/MgO nanocomposites were fabricated by mechanical mixing, ultrasonication-based dispersion and casting processes. FTIR results have shown clear differences in the vibrations of C-H, epoxide rings, and main amine N-H groups. This confirms the interaction between MgO particles and the epoxy polymer matrix. X-ray diffraction analysis detected prominent peak at 18.35 degrees, along with additional ones at 43.44 degrees and 62.56 degrees, associated with the (200) and (220) planes of MgO crystal,
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